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For release: 02 Jun 2014

European Project "VERDI" provides Universal Verification Methodology (UVM) in SystemC to Accellera Systems Initiative as new industry standard proposal

UVM-SystemC language and class library presented at the North American SystemC User Group meeting co-located with the Design Automation Conference (DAC) on June 2, 2014

DRESDEN, Germany, June 2, 2014 - The partners in the European research project "Verification for heterogeneous Reliable Design and Integration" (VERDI) are pleased to provide the Universal Verification Methodology (UVM) class library developed in the SystemC/C++ language to the Accellera Systems Initiative for further industry standardization and adoption. UVM-SystemC is the result of a three year collaboration to develop a system-level verification methodology to make integrated circuits and embedded systems more reliable and their development more effective. The project is funded by the European Union's Seventh Framework Programme (FP7).

The Accellera Systems Initiative drives the UVM standardization and creation of the reference implementation based on IEEE Std. 1800-2012 (Standard for SystemVerilog-Unified Hardware Design, Specification, and Verification Language). The UVM-SystemC implementation is based on IEEE Std. 1666-2011 (Standard SystemC Language Reference Manual), which will make the verification methodology more language agnostic and thus truly universal. Various Accellera working groups, such as the SystemC verification working group as well as the multi-language verification working group, already expressed their interest in this development and welcome the donation of UVM-SystemC.

Unlike other initiatives to create UVM in SystemC, the proof-of-concept class library developed in the VERDI project uses identical constructs as defined in the UVM (SystemVerilog) standard for test and sequence creation, verification component and test bench configuration, and execution by means of simulation. This will facilitate a seamless introduction of UVM-SystemC for users familiar with either SystemC or UVM. The proof-of-concept implementation has been documented in a language reference manual, which describes all language constructs and semantics of the UVM-SystemC library.

"The donation of this UVM-SystemC class library to Accellera is a logical next step to further advance this system-level verification methodology for industry wide usage," said Karsten Einwich, VERDI project leader working at Fraunhofer IIS/EAS. "I would like to thank all partners in this project, NXP, Infineon, Continental, Magillem, and University Pierre and Marie Curie, which all contributed to the realization of UVM in SystemC, and the European Commission for funding this project."

The UVM-SystemC class library will be presented at the 20th North American SystemC User Group (NASCUG) meeting, which is co-located with the Design Automation Conference (DAC) on June 2, 2014. In a keynote speech held by Karsten Einwich, the concepts of UVM-SystemC are presented and it will be shown how they can be applied to real-world designs from the digital and mixed-signal domains. Registration for the NASCUG meeting is free of charge at

About Fraunhofer IIS, Division EAS (IIS/EAS), Germany - project leader

The Fraunhofer-Gesellschaft is the biggest organization for research of practical utility in Europe. The Institute for Integrated Circuits IIS operates in the fields of microelectronic systems and software. Its Design Automation Division EAS is involved in the VERDI project. The scientists develop methods and tools for the reliable design of electronic and mechatronic systems becoming
more and more complex.

About NXP Semiconductors, Netherlands

The electronics industry is being driven by four mega trends that are helping shape our society: Energy Efficiency, Connected Devices, Security and Health. Connecting to these trends and enabling Secure Connections for a Smarter World, NXP Semiconductors creates solutions for the Connected Car, Cyber Security, Portable & Wearable and the Internet of Things. NXP is a global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.82 billion in 2013.

About University Pierre & Marie Curie, LIP6, France

UPMC is the leading scientific and medical university in France. It is now part of the Sorbonne University, one of the most comprehensive university centers in France. UPMC is involved in VERDI through the System on Chip (SoC) division within the Laboratory of Computer Sciences (LIP6), which is part of the French national scientific research center (CNRS). The research areas of the SoC division focus on algorithms, design methods and tools for heterogeneous systems on chip allowing embedded hardware/software applications. The LIP6 is leading the Master of Science on Electronics and Computer science at UPMC.

About Magillem Design Services, France

Since its creation in 2006, Magillem has been the pioneer in leveraging business content in top tier accounts worldwide. Magillem has been listed on Euronext Paris since 2009 (FR0010827741) and is trusted by numerous clients like Altera, Intel, Samsung, Qualcomm, NXP, ST Microelectronics, Texas Instruments, Thales, l'Agence Spatiale Européenne and the European Union. In 2012-2013, company sales totaled 5 million, 80% from export. Magillem has 45 employees, including 40 engineers and PhDs in Research & Development alone. It also has an office in Tokyo, 4 agencies in the
United States (New York, Austin and the San Francisco Bay area) and 8 distributors in Asia and Israel. Magillem is a member of Systematic and Cap Digital competitive business clusters, and in 2011
opened a 5-year joint research laboratory with the CEA (Commissariat à l'Énergie Atomique et aux Énergies Alternatives / French Alternative Energies and Atomic Energy Commission) on the topic of co-designing hardware, software and documentation.

About Infineon Technologies Austria AG, Austria

Infineon Technologies Austria AG with its headquarters in Villach, its Research and Development Centers in Villach, Graz, and Linz as well as its IT Services GmbH in Klagenfurt, and a Sales Office in Vienna, with a total staff of 3,100 employees throughout Austria (1100 of these in research and development), generated total sales of about 1,181.7 million Euros (including DICE) in the fiscal year 2013 (to end of September). Infineon Technologies Austria AG is a member of the Infineon Technologies AG group of companies.

About Continental AG, Germany

With sales of around 33.3 billion in 2013, Continental is one of the world's leading automotive suppliers. As a provider of brake systems, systems and components for powertrains and chassis, instrumentation, infotainment solutions, vehicle electronics, tires and technical elastomers, Continental contributes to enhanced driving safety and global climate protection. Continental is also an expert partner in networked automobile communication. Continental currently employs around 182,000 people in 49 countries.

About Continental Automotive France SAS

Continental Automotive France founded in 1978 is the French establishment of the Continental Automotive Group. With its three divisions, Powertrain, Chassis & Safety and Interior.

As a partner to the automotive and commercial vehicle industry, it develops and produces innovative products and systems for a modern automotive future in which cars provide individual mobility and driving pleasure consistent with driving safety, environmental responsibility, and cost-efficiency.

Media contacts:

Fraunhofer IIS, Division EAS
Sandra Kundel, Corporate Communications
Phone: +49 351 4640-809

NXP Semiconductors
Stefanie Linke, Global MarCom Manager, BU Automotive
Phone: +49 40 5613 5474

Université Pierre & Marie Curie, LIP6
Marie-Minerve Louërat
Phone: +33 14427 7108

Magillem Design Services
Lamia Lakehal
Phone: +33 14021 3550

Infineon Technologies Austria AG
Dr. Ingrid Lawicka
Phone: +43 5 17 77 2004

Continental, Chassis & Safety Division Sören Pinkow, External Communications Phone: +49 69 7603 8492

Continental Automotive France SAS
Gaelle Jamet-Vedrines
Phone: +33 1 3457 4026

For More Information, Contact:

Stefanie Linke
Phone: +49 40 5613 5474
Email Stefanie Linke